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Jointly commercialize ZoneBOND technology for thin wafer handling
December 7, 2011
By: DAVID SAVASTANO
Brewer Science, Inc., the inventor of ZoneBOND technology, and SUSS MicroTec are joining forces in commercializing ZoneBOND technology for thin wafer handling. SUSS MicroTec, market leader in room temperature debonding process equipment, is now offering the Brewer Science ZoneBOND process on the XBC300 and XBS300 platforms, targeted for high volume bonding and debonding of 200/300mm wafers using silicon or glass carriers.
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